"In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on ..."

Wuyu Zhang et al. (2023)

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DOI: 10.1109/TIE.2022.3172768

access: closed

type: Journal Article

metadata version: 2023-12-05

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Wuyu Zhang, Kun Tan, Bing Ji, Lei Qi, Xiang Cui, Xiangyu Zhang, Luchun Du:
In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot. IEEE Trans. Ind. Electron. 70(3): 3045-3054 (2023)

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