"Impact of Intrinsic Parameter Dispersion on Short-Circuit Reliability of ..."

Renze Yu, Saeed Jahdi, Phil H. Mellor (2024)

> Home

Details and statistics

DOI: 10.1109/TIE.2024.3383026

access: closed

type: Journal Article

metadata version: 2024-11-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tie/YuJM24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tie/YuJM24
Renze Yu, Saeed Jahdi, Phil H. Mellor:
Impact of Intrinsic Parameter Dispersion on Short-Circuit Reliability of Parallel-Connected Planar and Trench SiC MOSFETs. IEEE Trans. Ind. Electron. 71(12): 15599-15609 (2024)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.