"Online Monitoring Bond Wires Fault of SiC MOSFETs With Kelvin Package ..."

Minghang Xie et al. (2024)

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DOI: 10.1109/TIE.2023.3329162

access: closed

type: Journal Article

metadata version: 2024-05-04

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Minghang Xie, Pengju Sun, Wenyuan Ouyang, Quanming Luo, Xiong Du:
Online Monitoring Bond Wires Fault of SiC MOSFETs With Kelvin Package Based on Turn-on Source Voltage Ringing. IEEE Trans. Ind. Electron. 71(8): 9767-9776 (2024)

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