"Integrated Circuit Gold Wire Bonding Measurement Via 3-D Point Cloud Deep ..."

Qian Xie et al. (2022)

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DOI: 10.1109/TIE.2021.3120473

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type: Journal Article

metadata version: 2025-01-06

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Qian Xie, Kun Long, Dening Lu, Dawei Li, Yuan Zhang, Jun Wang:
Integrated Circuit Gold Wire Bonding Measurement Via 3-D Point Cloud Deep Learning. IEEE Trans. Ind. Electron. 69(11): 11807-11815 (2022)

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