default search action
"High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using ..."
Zilian Qu et al. (2022)
- Zilian Qu, Wensong Wang, Zhengchun Yang, Qiwen Bao, Yuanjin Zheng:
High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques. IEEE Trans. Ind. Electron. 69(9): 9556-9565 (2022)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.