"High-Performance RF Power Amplifier Module Using Optimum Chip-Level ..."

Hyosung Nam et al. (2022)

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DOI: 10.1109/TIE.2021.3088328

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type: Journal Article

metadata version: 2022-08-18

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Hyosung Nam, Jihoon Kim, Jooyoung Jeon, Hee-Sauk Jhon, Junghyun Kim:
High-Performance RF Power Amplifier Module Using Optimum Chip-Level Packaging Structure. IEEE Trans. Ind. Electron. 69(6): 5660-5668 (2022)

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