default search action
"Packaging and integration technologies for future high-frequency power ..."
Seán Cian O'Mathuna et al. (2004)
- Seán Cian O'Mathuna, Patrick Byrne, Gerald Duffy, Weimin Chen, Matthias Ludwig, Terence O'Donnell, Paul McCloskey, Maeve Duffy:
Packaging and integration technologies for future high-frequency power supplies. IEEE Trans. Ind. Electron. 51(6): 1305-1312 (2004)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.