"Massive MIMO With Massive Connectivity for Industrial Internet of Things."

Byung Moo Lee, Hong Yang (2020)

> Home

Details and statistics

DOI: 10.1109/TIE.2019.2924855

access: closed

type: Journal Article

metadata version: 2020-05-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tie/LeeY20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tie/LeeY20
Byung Moo Lee, Hong Yang:
Massive MIMO With Massive Connectivity for Industrial Internet of Things. IEEE Trans. Ind. Electron. 67(6): 5187-5196 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.