"Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in ..."

Hongtai Cheng, Heping Chen, Benjamin W. Mooring (2014)

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DOI: 10.1109/TIE.2013.2261034

access: closed

type: Journal Article

metadata version: 2020-05-22

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Hongtai Cheng, Heping Chen, Benjamin W. Mooring:
Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in Semiconductor Manufacturing. IEEE Trans. Ind. Electron. 61(3): 1402-1410 (2014)

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