"Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed ..."

Csaba Benedek et al. (2013)

> Home

Details and statistics

DOI: 10.1109/TIE.2012.2193859

access: closed

type: Journal Article

metadata version: 2020-05-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tie/BenedekKJJ13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tie/BenedekKJJ13
Csaba Benedek, Olivér Krammer, Mihály Janoczki, László Jakab:
Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards. IEEE Trans. Ind. Electron. 60(6): 2318-2331 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.