"TSV Based Orthogonal Coils With High Misalignment Tolerance for Inductive ..."

Libo Qian et al. (2021)

> Home

Details and statistics

DOI: 10.1109/TCSII.2020.3048040

access: closed

type: Journal Article

metadata version: 2021-06-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcasII/QianQSXWX21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcasII/QianQSXWX21
Libo Qian, Kefang Qian, Yong Shi, Huakang Xia, Jian Wang, Yinshui Xia:
TSV Based Orthogonal Coils With High Misalignment Tolerance for Inductive Power Transfer in Biomedical Implants. IEEE Trans. Circuits Syst. II Express Briefs 68(6): 1832-1836 (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.