"A Configurable Multi-Rail Power and I/O Pad Applied to Wafer-Scale Systems."

Nicolas Laflamme-Mayer et al. (2014)

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DOI: 10.1109/TCSI.2014.2334911

access: closed

type: Journal Article

metadata version: 2020-05-22

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Nicolas Laflamme-Mayer, Yves Blaquière, Yvon Savaria, Mohamad Sawan:
A Configurable Multi-Rail Power and I/O Pad Applied to Wafer-Scale Systems. IEEE Trans. Circuits Syst. I Regul. Pap. 61-I(11): 3135-3144 (2014)

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