"On Hamming Product Codes With Type-II Hybrid ARQ for On-Chip Interconnects."

Bo Fu, Paul Ampadu (2009)

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DOI: 10.1109/TCSI.2009.2026679

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type: Journal Article

metadata version: 2020-05-22

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Bo Fu, Paul Ampadu:
On Hamming Product Codes With Type-II Hybrid ARQ for On-Chip Interconnects. IEEE Trans. Circuits Syst. I Regul. Pap. 56-I(9): 2042-2054 (2009)

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