"Thermal-Aware Modeling and Analysis for a Power Distribution Network ..."

Weijun Zhu, Gang Dong, Yintang Yang (2019)

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DOI: 10.1109/TCAD.2018.2846659

access: closed

type: Journal Article

metadata version: 2020-09-24

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Weijun Zhu, Gang Dong, Yintang Yang:
Thermal-Aware Modeling and Analysis for a Power Distribution Network Including Through-Silicon-Vias in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(7): 1278-1290 (2019)

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