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"A Post-Bond TSV Test Method Based on RGC Parameters Measurement."

Yang Yu, Xu Fang, Xiyuan Peng (2020)

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DOI: 10.1109/TCAD.2018.2887051

access: closed

type: Journal Article

metadata version: 2020-09-24

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Yang Yu, Xu Fang, Xiyuan Peng:
A Post-Bond TSV Test Method Based on RGC Parameters Measurement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(2): 506-519 (2020)

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