"ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis."

Yonghong Yang et al. (2007)

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DOI: 10.1109/TCAD.2006.882589

access: closed

type: Journal Article

metadata version: 2020-09-24

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Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Robert P. Dick, Li Shang:
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 26(1): 86-99 (2007)

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