"STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs."

Hai Wang et al. (2019)

> Home

Details and statistics

DOI: 10.1109/TCAD.2018.2877019

access: closed

type: Journal Article

metadata version: 2023-03-01

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/WangHLZTY19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/WangHLZTY19
Hai Wang, Darong Huang, Rui Liu, Chi Zhang, He Tang, Yuan Yuan:
STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(11): 2058-2071 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.