"TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield ..."

Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri (2021)

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DOI: 10.1109/TCAD.2020.3021341

access: closed

type: Journal Article

metadata version: 2021-07-29

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Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri:
TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(8): 1500-1510 (2021)

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