"Stacking Signal TSV for Thermal Dissipation in Global Routing for 3-D IC."

Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang (2014)

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DOI: 10.1109/TCAD.2014.2307488

access: closed

type: Journal Article

metadata version: 2020-09-24

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Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang:
Stacking Signal TSV for Thermal Dissipation in Global Routing for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(7): 1031-1042 (2014)

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