"Interconnect thermal modeling for accurate simulation of circuittiming and ..."

Danqing Chen et al. (2000)

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DOI: 10.1109/43.828548

access: closed

type: Journal Article

metadata version: 2020-09-24

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Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang:
Interconnect thermal modeling for accurate simulation of circuittiming and reliability. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 19(2): 197-205 (2000)

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