"Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and ..."

Jacob Dawes et al. (2024)

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DOI: 10.1109/TBCAS.2024.3419804

access: closed

type: Journal Article

metadata version: 2024-09-20

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Jacob Dawes, Tzu-Hsuan Chou, Boyu Shen, Matthew L. Johnston:
Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects. IEEE Trans. Biomed. Circuits Syst. 18(4): 821-833 (2024)

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