"Thermal-Stress Coupling Optimization for Coaxial through Silicon Via."

Dongdong Chen et al. (2023)

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DOI: 10.3390/SYM15020264

access: open

type: Journal Article

metadata version: 2023-04-20

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  - https://dblp.org/rec/journals/symmetry/ChenYWLLX23
Dongdong Chen, Yintang Yang, Xianglong Wang, Di Li, Yi Liang, Changqing Xu:
Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. Symmetry 15(2): 264 (2023)

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