"High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and ..."

Liying Wang et al. (2017)

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DOI: 10.3390/S17030599

access: open

type: Journal Article

metadata version: 2018-11-14

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  - https://dblp.org/rec/journals/sensors/WangDWXZG17
Liying Wang, Xiaohui Du, Lingyun Wang, Zhanhao Xu, Chenying Zhang, Dandan Gu:
High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor. Sensors 17(3): 599 (2017)

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