"Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer."

Jinxing Liang et al. (2015)

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DOI: 10.3390/S150922049

access: open

type: Journal Article

metadata version: 2018-11-14

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Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda:
Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors 15(9): 22049-22059 (2015)

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