"Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip ..."

Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao (2015)

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DOI: 10.1002/QRE.1611

access: closed

type: Journal Article

metadata version: 2020-07-09

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Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao:
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. Qual. Reliab. Eng. Int. 31(4): 543-566 (2015)

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