"Using Copulas to Model and Simulate Two-dimensional Warranty Data."

Boyd Anderson, Stefanka S. Chukova, Yuichi Hirose (2017)

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DOI: 10.1002/QRE.2043

access: closed

type: Journal Article

metadata version: 2022-12-01

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Boyd Anderson, Stefanka S. Chukova, Yuichi Hirose:
Using Copulas to Model and Simulate Two-dimensional Warranty Data. Qual. Reliab. Eng. Int. 33(3): 595-605 (2017)

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