"3-D ICs: a novel chip design for improving deep-submicrometer interconnect ..."

Kaustav Banerjee et al. (2001)

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DOI: 10.1109/5.929647

access: closed

type: Journal Article

metadata version: 2021-08-17

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Kaustav Banerjee, Shukri J. Souri, Pawan Kapur, Krishna C. Saraswat:
3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proc. IEEE 89(5): 602-633 (2001)

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