"Overview of wire bonding using copper wire or insulated wire."

Z. W. Zhong (2011)

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DOI: 10.1016/J.MICROREL.2010.06.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Z. W. Zhong:
Overview of wire bonding using copper wire or insulated wire. Microelectron. Reliab. 51(1): 4-12 (2011)

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