"Thermomechanical property of diffusion barrier layer and its effect on the ..."

Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho (2002)

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DOI: 10.1016/S0026-2714(01)00121-4

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho:
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectron. Reliab. 42(1): 27-34 (2002)

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