"Development of process modeling methodology for flip chip on flex ..."

Xiaowu Zhang et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.07.112

access: closed

type: Journal Article

metadata version: 2020-10-26

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Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao:
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectron. Reliab. 45(7-8): 1215-1221 (2005)

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