"Response surface models for efficient, modular estimation of solder joint ..."

L. Zhang et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.06.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose:
Response surface models for efficient, modular estimation of solder joint reliability in area array packages. Microelectron. Reliab. 45(3-4): 623-635 (2005)

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