"Monitoring extent of curing and thermal-mechanical property study of ..."

Jie Zhang et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.11.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jie Zhang, Tian Li, Huiping Wang, Yi Liu, Yingfeng Yu:
Monitoring extent of curing and thermal-mechanical property study of printed circuit board substrates. Microelectron. Reliab. 54(3): 619-628 (2014)

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