"Study of a dipping method for flip-chip flux coating."

Wei Zhang, Junhui Li, Lei Han (2014)

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DOI: 10.1016/J.MICROREL.2014.04.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wei Zhang, Junhui Li, Lei Han:
Study of a dipping method for flip-chip flux coating. Microelectron. Reliab. 54(11): 2479-2486 (2014)

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