"Fatigue life evaluation of wire bonds in LED packages using numerical ..."

Sung-Uk Zhang, Bang Weon Lee (2014)

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DOI: 10.1016/J.MICROREL.2014.07.142

access: closed

type: Journal Article

metadata version: 2020-02-22

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Sung-Uk Zhang, Bang Weon Lee:
Fatigue life evaluation of wire bonds in LED packages using numerical analysis. Microelectron. Reliab. 54(12): 2853-2859 (2014)

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