"Development of SnAg-based lead free solders in electronics packaging."

Liang Zhang et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.10.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang:
Development of SnAg-based lead free solders in electronics packaging. Microelectron. Reliab. 52(3): 559-578 (2012)

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