"Reliability study of board-level lead-free interconnections under ..."

Bo Zhang, Han Ding, Xinjun Sheng (2009)

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DOI: 10.1016/J.MICROREL.2009.02.024

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type: Journal Article

metadata version: 2022-11-02

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Bo Zhang, Han Ding, Xinjun Sheng:
Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact. Microelectron. Reliab. 49(5): 530-536 (2009)

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