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"Thermodynamic study on the corrosion mechanism of copper wire bonding."
Yingzhi Zeng, Kewu Bai, Hongmei Jin (2013)
- Yingzhi Zeng, Kewu Bai, Hongmei Jin:
Thermodynamic study on the corrosion mechanism of copper wire bonding. Microelectron. Reliab. 53(7): 985-1001 (2013)
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