"Effect of voids on the reliability of BGA/CSP solder joints."

Mohammad Yunus et al. (2003)

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DOI: 10.1016/S0026-2714(03)00124-0

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mohammad Yunus, K. Srihari, James M. Pitarresi, Anthony Primavera:
Effect of voids on the reliability of BGA/CSP solder joints. Microelectron. Reliab. 43(12): 2077-2086 (2003)

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