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"Effect of voids on the reliability of BGA/CSP solder joints."
Mohammad Yunus et al. (2003)
- Mohammad Yunus, K. Srihari, James M. Pitarresi, Anthony Primavera:
Effect of voids on the reliability of BGA/CSP solder joints. Microelectron. Reliab. 43(12): 2077-2086 (2003)
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