"Development of reliable low temperature wafer level hermetic bonding using ..."

Daquan Yu (2012)

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DOI: 10.1016/J.MICROREL.2011.10.027

access: closed

type: Journal Article

metadata version: 2020-02-22

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Daquan Yu:
Development of reliable low temperature wafer level hermetic bonding using composite seal joint. Microelectron. Reliab. 52(3): 589-594 (2012)

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