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"Effects of isothermal aging and temperature-humidity treatment of ..."

Jeong-Won Yoon et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.065

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung:
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. Microelectron. Reliab. 48(11-12): 1864-1874 (2008)

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