"Electromigration Performance of Multi-level Damascene Copper Interconnects."

Shinji Yokogawa et al. (2001)

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DOI: 10.1016/S0026-2714(01)00162-7

access: closed

type: Journal Article

metadata version: 2021-02-10

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Shinji Yokogawa, Norio Okada, Yumi Kakuhara, Hideyuki Takizawa:
Electromigration Performance of Multi-level Damascene Copper Interconnects. Microelectron. Reliab. 41(9-10): 1409-1416 (2001)

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