"Finite element analysis of thermal stress for different Cu interconnects ..."

Wang Ying, Ji Feng-li, Gao Song-song (2012)

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DOI: 10.1016/J.MICROREL.2012.05.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wang Ying, Ji Feng-li, Gao Song-song:
Finite element analysis of thermal stress for different Cu interconnects structure. Microelectron. Reliab. 52(11): 2856-2860 (2012)

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