"Characterisation of IC packaging interfaces and loading effects."

H. C. Yeo et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.087

access: closed

type: Journal Article

metadata version: 2022-10-05

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H. C. Yeo, Ningqun Guo, Hejun Du, Weimin Huang, X. M. Jian:
Characterisation of IC packaging interfaces and loading effects. Microelectron. Reliab. 46(9-11): 1892-1897 (2006)

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