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"Consideration of temperature and current stress testing on flip chip ..."
Alfred Yeo, Bernd Ebersberger, Charles Lee (2008)
- Alfred Yeo, Bernd Ebersberger, Charles Lee:
Consideration of temperature and current stress testing on flip chip solder interconnects. Microelectron. Reliab. 48(11-12): 1847-1856 (2008)
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