"Experimental investigation of the failure mechanism of Cu-Sn intermetallic ..."

Chaoran Yang, Fuliang Le, S. W. Ricky Lee (2016)

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DOI: 10.1016/J.MICROREL.2016.03.021

access: closed

type: Journal Article

metadata version: 2021-10-14

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Chaoran Yang, Fuliang Le, S. W. Ricky Lee:
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints. Microelectron. Reliab. 62: 130-140 (2016)

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