default search action
"Chip warpage model for reliability prediction of delamination failures."
Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee (2012)
- Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee:
Chip warpage model for reliability prediction of delamination failures. Microelectron. Reliab. 52(4): 718-724 (2012)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.