"Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce ..."

H. X. Xie, Nikhilesh Chawla (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2012.12.010

access: closed

type: Journal Article

metadata version: 2020-09-10

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/XieC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/XieC13
H. X. Xie, Nikhilesh Chawla:
Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints. Microelectron. Reliab. 53(5): 733-740 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.