"Temperature-dependent stress-induced voiding in dual-damascene Cu ..."

Zhenyu Wu et al. (2008)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2007.12.001

access: closed

type: Journal Article

metadata version: 2024-02-08

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WuYCLWLL08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WuYCLWLL08
Zhenyu Wu, Yintang Yang, Changchun Chai, Yuejin Li, JiaYou Wang, Jing Liu, Bin Liu:
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects. Microelectron. Reliab. 48(4): 578-583 (2008)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.