"Board level reliability of a stacked CSP subjected to cyclic bending."

J. D. Wu et al. (2002)

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DOI: 10.1016/S0026-2714(01)00241-4

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung:
Board level reliability of a stacked CSP subjected to cyclic bending. Microelectron. Reliab. 42(3): 407-416 (2002)

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