"A review of board level solder joints for mobile applications."

Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim (2008)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2008.08.006

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WongSS08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WongSS08
Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim:
A review of board level solder joints for mobile applications. Microelectron. Reliab. 48(11-12): 1747-1758 (2008)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.